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Natural Heat Dissipation Design

The natural heat dissipation of highenergy-consumption system is the challenge faced by thermal design. Throughthermal simulation analysis, Orea Company completed four industrial-gradeswitch cases.In this case, system engineer makes theupper and lower cards joint to the top and bottom plates correspondingly, whichaccomplished the inner heat's conduction to the outer shell surfaces.

 



Forced Air Cooling Design

Typical air duct of left-inlet &right-outlet horizontal heat dissipation for 9U cards. To provide max heatdissipation capacity, 120×120 and 92×92 fans shall be staggered to ensure theoverall coverage of allslotsthis heat dissipation method is reliableand stable, frequently applied by communication equipment. Orea Company hasfinished more than 30 cases applying such design method.



 

Liquid Cooling Design

When ascending curve of electronic productwhole-machine energy consumption and descending curve of energy-savingemission-reduction trend are gradually inclined to intersect, liquid coolingheat dissipation technology comes into being correspondingly. Liquid coolingheat dissipation method has high efficiency, whose thermal conductivit is 20times more than traditional air cooling method and also can solve thedissipation problems caused by higher heat consumption. It has also played animportant role in IDC machine room and other industries with high heatconsumption and mass arrangement. Orea has also begun to do research on liquidcooling heat dissipation technology and structural design, aiming at providingliquid cooling solution for customers.

TD for systems

In the given heat dissipation environment,design a reasonable air duct and cooling fan module for the entire cabinetsystem, and then finish the thermal simulation and assessment of overallsystem-level by means of simulation software. In the thermal design for largehost system, Orea has designed intersecting system air duct, adoptedcentrifugal fan, fan box, and wind scooper, and also implemented the thermalsimulation for the whole cabinet. The figure below is the cloud picture forthermal simulation: System Air Duct Design.

The air temperature and speed cloud pictureof large server system is show bellowed

 

TD for modules

In the given heat dissipation environment,arrange the components of module reasonably layout adjustment and local hotspotelimination shall be conducted inside the module

Cloud picture for thermal simulation ofswitching module and supervision module is shown below.

The air temperature and speed cloud pictureof switch module and monitor module is show bellowed

TD for components

Improvement measures such as strengtheningheat dissipation capacity, optimizing heat dissipation parts and adjusting heatdissipation resources shall be applied for keyComponents.

The air temperature and speed cloud pictureof I/O module is show bellowed

Cloud Picture Showing Temperature of I/OModule and Cloud Picture Showing Speed of I/O Module

 

Noise control and optimization

System noise shall be considered about inthe process of system thermal design. Through reasonable air duct design andoptimization, and reasonable fan model selection, the noise generated by theentire system will be controlled within the required scope. In the complex systemnoise design, the allowed system noise under the full speed of high temperaturefan is 70.8~73.8dB-A; while system noise for speed regulation under normaltemperature (rotating speed accounts for 60% of the full speed) is 60~63dB-A.Fan model selection is shown in figure below.

 


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